The National Advanced Packaging Manufacturing Program (NAPMP) under the CHIPS and Science Act aims to strengthen U.S. leadership in advanced semiconductor packaging through research and development (R&D) activities. The 2025 Notice of Funding Opportunity (NOFO) outlines a significant investment in domestic advanced packaging through five key R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology (including Photonics and Radio Frequency); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA).

The NAPMP's primary goal is to drive innovation and establish the United States as a global leader in advanced semiconductor packaging, particularly for high-performance computing and low-power electronics. The program seeks to support domestic manufacturing capabilities and develop a skilled workforce to meet the demands of the packaging industry. Within a decade, NAPMP's funded activities, along with CHIPS manufacturing incentives, aim to create a vibrant, self-sustaining domestic industry capable of packaging advanced-node chips produced both domestically and abroad.

This NOFO specifically focuses on fostering R&D efforts that address critical technological gaps in advanced packaging. The program encourages projects that contribute to developing new tools, materials, and processes, as well as scaling down packaging dimensions and improving power delivery and thermal management. Projects must demonstrate a strong potential for commercial adoption, making their results implementable at scale within the U.S. manufacturing ecosystem.

Eligible applicants for this program include domestic non-profit organizations, accredited institutions of higher education, state, local, and tribal governments, and for-profit organizations. Awards will be made through "other transaction agreements" (OTAs), which offer flexibility in the scope and terms of the agreements, allowing the Department of Commerce to engage with a diverse range of partners. A total of $1.55 billion is anticipated for multiple awards, with amounts ranging from $10 million to $150 million over a five-year period.

The application process requires the submission of a concept paper, which is a prerequisite for submitting a full application. Concept papers must address one of the five R&D areas and provide a detailed technical plan, milestones, and targets. Following the concept paper review, selected applicants will be invited to submit full applications, which will undergo a merit-based review process. Evaluation criteria include scientific and technical merit, project management capabilities, the potential for impact on the domestic packaging industry, and plans for workforce development.

Key dates include the Proposers Day on October 22, 2024, where interested organizations can learn more about the opportunity. Concept papers are due by December 20, 2024, and full applications will be due 60 days after invitation. The program aims to award grants in mid-2025, with project activities expected to begin in late 2025. Proposers are encouraged to form multidisciplinary teams that bring together the necessary expertise and resources to address the technical challenges in advanced packaging.

The NAPMP offers a unique opportunity for researchers, manufacturers, and academic institutions to collaborate on advancing semiconductor packaging technology and securing U.S. competitiveness in the global semiconductor industry【14†source】.